MEMS & Batteries

The system will be used to develop highly integrated components that combine sensors, actuators, data processing, energy storage and wireless communication in a very small space. Atomic layer deposition (ALD) is ideal for high integration density, as it allows not only 2D but also 3D structures – such as trenches or upright cylinders to be coated evenly from all sides on a microscopic level. The system will be used for development and sample production on an industrial scale, and will, therefore, be able to accept and coat batches of 300 mm wafers via a standardized FOUB interface. Simultaneously, as a development system, it must also be able to process undesirable materials such as lithium, gold or copper in CMOS processes, offer a wide range of ALD processes (plasma ALD and thermal ALD in crossflow and showerhead reactors) and be modified by the user or manufacturer at a later date for new research projects. After all, the system must be able to complete complex formulas automatically, continuously record all process data and enable different user levels.