Thin Film Sensor Cluster

The system will be used to produce sensors, i.e. conductor tracks, capacitors, resistors, piezoresistive layers etc. will be deposited on 200 mm wafers. These thin layers of metals, oxides or nitrides must be applied over the entire wafer with a layer thickness deviation of less than +/- 3 % and must adhere well to the substrate and to each other. The system must be compatible with the SEMI standard so that upstream and downstream processes from the semiconductor industry (e.g. for structuring) can be used. In addition, the system must, naturally, be able to run fully automated formulas for different sensors and coat an entire batch of substrates in one piece without external intervention. Finally, the system must be flexible and expandable in the future, so that small batches of special sensors can be produced on it or new technologies for sensor production (e.g. atomic layer deposition) can be subsequently integrated.